XC7K325T-2FFG900I

The XC7K325T-2FFG900I is an FPGA (Field-Programmable Gate Array) chip produced by Xilinx, featuring high performance, low power consumption, and a wealth of functional characteristics based on the Kintex-7 series. Below are the detailed parameters of this chip:

Basic Parameters:

• Model: XC7K325T-2FFG900I
• Chip Series: Kintex-7
• Package: FCBGA-900 (Some materials also mention FFG900 or FFG-900, which may vary slightly due to different batches or descriptions)
• Operating Temperature Range: -40°C ~ 100°C (Some materials specify a maximum operating temperature of +100°C and a minimum operating temperature of -40°C)
• Speed Grade: May vary depending on sources, but generally correlates with performance
• Chip Size: Approximately 31mm x 31mm (This is an estimated size and may vary slightly due to the packaging form)

Performance Parameters:

• Logic Elements (LEs): 325,200 (Some materials mention 326,080, which may vary slightly due to different batches or descriptions)
• Memory Capacity: 21,504Kb (or expressed as 16,020Kbit, depending on memory configuration)
• DSP Slices: 1,920 (The number of DSP processing units may vary depending on the configuration)
• Maximum Clock Frequency: 400MHz (Some materials mention a maximum operating frequency of up to 640MHz, which depends on specific application scenarios and configurations)
• I/O Count: 500 (Some materials mention 400 input/output pins, which may vary due to different packaging or configurations)
• Data Rate: Up to 6.6 Gb/s (This typically refers to the data rate of high-speed serial connections)

Technical Features:

• Process Technology: Built on 28nm, high-k metal gate (HKMG) process technology
• High-Performance SelectIO Technology: Supports DDR3 interfaces up to 1,866 Mb/s
• High-Speed Serial Connectivity: Integrated multi-gigabit transceivers with rates ranging from 600 Mb/s to a maximum of 28.05 Gb/s
• User-Configurable Analog Interface (XADC): Includes dual 12-bit, 1MSPS analog-to-digital converters and on-chip thermal and power supply sensors
• Advanced Clock Management Tile (CMT): Combines phase-locked loops (PLLs) and mixed-mode clock managers (MMCMs) for high precision and low jitter
• PCI Express (PCIe) Blocks: Supports x8 Gen3 endpoint and root port designs

Other Parameters:

• Supply Voltage: May vary depending on sources, but typically ranges between 0.95V to 1.05V or 0.97V to 1.03V
• Mounting Method: Surface-Mount Device (SMD/SMT)
• Product Lifecycle: Active (Indicates the product is still in production and available for purchase)

Application Areas:

The XC7K325T-2FFG900I chip is suitable for high-performance computing, communications, video processing, and other fields, particularly excelling in scenarios requiring high-speed data transmission, high bandwidth, and high-capacity processing. It can also be used in optical fiber communications, industrial control, data processing, and various other application scenarios.

Please note that chip parameters may vary due to different batches, production processes, or configurations. Therefore, in practical applications, it is recommended to refer to the latest official data sheets or contact the supplier for the most accurate information.